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Insights

Long form work on how industries and institutions are built, and what technology is doing to them.

Full write ups rather than summaries. Each one works through a system from the bottom up, with the numbers shown and the sources named.

2D materials, neuromorphic and quantum

1 Piece

ABF and BT resin IC package substrates

1 Piece

AI and Institutions

5 Pieces

Five papers, written to be read in order. They work through what happens to an institution when an AI system is placed next to one of its decisions.

Advanced packaging: CoWoS, 2.5D/3D chiplets and why packaging became the bottleneck

1 Piece

Analog ICs

1 Piece

Co-packaged optics and silicon photonics

1 Piece

Compound semiconductors: InP, GaAs, GaN in photonics and 5G RF

1 Piece

EUV lithography: 13.5nm light, High-NA and ASML's monopoly

1 Piece

Electronic-grade silicon, Czochralski growth and the 300mm wafer oligopoly

1 Piece

Flexible OLED and the race to micro-LED: Samsung Display, CMOS image sensors

1 Piece

Gallium and germanium supply, China export controls and India

1 Piece

Gallium nitride and gallium oxide

1 Piece

Glass-core substrates and 3D interposers

1 Piece

HBM3e and the memory wall: DRAM oligopoly, HBM4 transition, Micron Sanand

1 Piece

High-speed PCB laminates and signal integrity

1 Piece

High-speed connectors and relays: TE Connectivity, why electromechanical parts survive in EVs

1 Piece

MEMS sensors at industrial scale: Bosch Sensortec, automotive and industrial demand

1 Piece

MLCCs

1 Piece

OSAT and ATMP: back-end assembly economics and India's entry

1 Piece

Passive Components

1 Piece

Photoresists, JSR and specialty chemical chokepoints in semiconductors

1 Piece

Rare earths, mining and chemical refining

1 Piece

SMT and THT assembly materials

1 Piece

Silicon Carbide

1 Piece

Thin-film deposition and plasma etch: ALD, PECVD, PVD, epitaxy and the high-aspect-ratio frontier

1 Piece

Electrical Steel

3 Pieces

Ethanol

3 Pieces